Application
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- 100GBASE-LR4 Ethernet links
- Data Center Intra Networking
- Data Center Interconnection(DCI)
Features
- COB (Chip on Board) packaging technology
- Support 25.78Gbps per channel and 103.1Gbps aggregate bit rate
- 4 x 25Gb/s DFB-based LAN-WDM DML transmitter
- 4 x 25G electrical interface
- Up to reach 10km on SMF
- 3.3V power supply voltage
- Power dissipation < 3.5W
- Operating Case Temperature: 0~70℃
- Duplex LC connector
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